招募Linux系统下驱动和BSP开发工程师（外派爱立信）

yattai

招募Linux系统下驱动和BSP开发工程师（外派爱立信） [复制链接]

大家好，

我是纬创软件HR Ryan，我们正在招募Linux系统下驱动和BSP开发工程师，外派到爱立信研发部门工作。以下是职位的具体JD。请感兴趣的筒子请把简历发到我的邮箱：zhifeihu@wistronits.com

Job Title:

Device Driver and BSP SW Design Engineer

Job Objective:
The position will be responsible for device driver design in IP and broadband product area, such as GPON, OMS, Mini-Link and IP router. As software design engineer, develop or modify the products to meet the customer's requirements as well as fulfill the business requirements on cost, time and quality.

Responsibilities:
-      Responsible for design and maintenance of device driver/BSP/HW adaptation layer  design on telecommunication equipments
-      Participate in systemization together with people from System team and integration test with HW team
-      Responsible for writing technical documents, e.g. Implementation proposal, Design specification, Test Specification, and etc.
-      Responsible for coding ,unit test, basic integration test of SW functions
-      Integrate software with third part software modules
-      Review source code & documents
-      Efficiently communicate with engineers from other teams in China and other countries

Qualifications & Requirements:
-      M.Sc. or B.Sc in Computer Science or telecommunication engineering or related discipline (Masters preferred)
-      Strong C programming skills
-      Deep understanding about RTOS kernel (Vxworks,pSos,Linux), embedded Linux experience is a good plus; the knowledge in digital HW is an advantage
-      Solid understanding of file system/processes/multi-threading/device driver
-      Strong knowledge on CPU architecture (MPC, PPC, MIPS, ARM etc), especial on RISC architecture
-      2 years or above BSP/Driver SW development experience, like I2C, MAC, Flash, PCI, PBI,CF card
-      2 years or above experience in network processor control, like Broadlight PON Chip, Broardcom/Marvell Switch Chip, Maxim CES Chip, Audiocodes DSP Chip, Infineon DSP Chip
-      Good understanding of networking technologies at Layer1/Layer2 (e.g., Ethernet switching, bridging, VLAN, WiFi, HDLC, PPP, SDH, PDH)
-      Good Analytic ability and good capacity to structure a problem and gather information
-      Good technical writing, communication skills and high proficiency in English both oral and written
-      Must be self-motivated, good team player; be able to work cohesively within the team and across geographically spread teams to accomplish results

js9413

好奇来关注

yangyi11056

我明年毕业了可以试下

anglesccs

呵呵，外派这个不好招强的。尤其是BSP的。

oemguide

不错