Because MIC design and fabrication are so interdependent, it is important to understand the overall thin-film process for successful circuit production. For example, the layout process depends on the fabrication process in the sense that changes in the fabrication process always affect the layout and therefore affect final performance. Therefore, once a layout is complete, it is best to go back to simulation and insert all related elements in the fabrication process, such as the bond wire lengths and parasitic effects. Often, several iterations will be required before desired performance and a realistic layout are achieved.
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