Recent RF technology roadmapping activities and conclusions are reviewed. Mainstream opportunities and technological constraints are reviewed or proposed. The frequency below which Si technologies displace III-V technologies for most active device functions except power amplifiers will continue to increase. RFIC integration levels will continue to increase until limited by power amplifiers, filters, or on-chip isolation. Handsets will integrate more computing power but become limited by available spectrum to communicate. The bandwidth of interconnects within a chip and within a rack will become limited by fundamental skin-effect losses or by the cost, density, or power consumption of optical interconnects. Various economic constraints may also slow or limit technological progress in each of these areas.
提升卡
变色卡
千斤顶
