本人猎头，受某外资半导体厂商委托，招聘以下职位：production manager/equipment manager/senior plating engineer。
投递简历或咨询：hunter.sweet@163.com
职位细节如下：
Production Manager
职位描述
Responsibility:
1) Production/Shopfloor management : Manage overall assembly production systematic and shopfloor management in order to achieve good manufacturing discipline, required logistic performance, Zero Defect requirement and lowest cost.
2) Maintenance: Manage overall assembly equipment maintenance systematic, actual maintenance activities and the maintenance personnel in order to achieve best equipment efficiency and maintenance cost.
3). Coordinate overall Total Productive Management (TPM) systematic/activities within Discrete Production including skill level training and certification and cross-functional improvement team.
4) People management: Recruit, develop, train, evaluate and motivate managers and key staffs, communicate and effectively deploy department objectives in order to ensure staffs are qualified and motivated and able to operate within their own area independently.
5) Coordinate all Safety, Health and Environment activities including OSHAS 18000 and EMS ISO14000 Audits in Discrete Production
6) Coordinate and align the deployment of policy and strategy in production.
任职要求
Qualification:
-4 years degree in an engineering (Electrical, Mechanical, Computer Science, Materials Engineering, Industrial Engineering and other related areas)
-Minimum 8 years experience in semiconductor backend assembly test experience with 3 years in production function
Specific :
1) Actual semiconductor Assembly test process knowledge.
2) Knowledge in Problem Solving Skill eg 8D and Poka Yoke
3) People Management through effective Interpersonal Skills, Self Managing Team (SMT), Small Group Activity (SGA) and Total Productive Maintenance (TPM)
4) Knowledge on Industrial Engineering, Capacity and Headcount Planning.
General:
1) Ability to lead, motivate and develop excellent Performance among employee.
2) Well develop personal management and human organization skills.
3) Analytical and having strong decision making capabilities
4) Able to work independently and posses good communication skills
1) Maintenance: Manage overall assembly equipment maintenance systematic, actual maintenance activities and the maintenance personnel in order to achieve best equipment efficiency and maintenance cost.
2) Equipment engineering: Manage and drive the machine innovative and improvement activities to achieve best equipment efficiency
3).Coordinate overall Total Productive Management (TPM) systematic/activities within Discrete Production including skill level training and certification and cross-functional improvement team.
4) People management: Recruit, develop, train, evaluate and motivate engineers and technicians, communicate and effectively deploy department objectives in order to ensure staffs are qualified and motivated and able to operate within their own area independently.
5) Coordinate all Safety, Health and Environment activities including OSHAS 18000 and EMS ISO14000 Audits
6) Coordinate and align the deployment of policy and strategy in Equipment Engineering and Maintenance.
任职要求
Qualification:
-4 years technical degree in an engineering discipline (Electrical, Mechanical, and other related areas)
-Minimum 8 years experience in semiconductor backend assembly & test experience with 3 years in production function
Specific:
1) Actual semiconductor Assembly & test process knowledge
2) Knowledge in Problem Solving Skill eg 8D and Poka Yoke
3) People Management through effective Interpersonal Skills, Self Managing Team (SMT), Small Group Activity (SGA) and Total Productive Maintenance (TPM)
4) Knowledge on Backend Semiconductor Equipments
General:
1) Ability to lead, motivate and develop excellent Performance among employee
2) Well develop personal management and human organization skills
3) Analytical and having strong decision making capabilities
4) Able to work independently and posses good communication skills
Manage and drive improvement plating process in subcon
1) Coordinate and drive the plating subcon house new package qualification activities
2) Drive the subcon to increase the manufacturing flexibility
3) Coordinate with Subcon to ensure the JHAM, maintenance, 5S activities are in place.
4) Coordinate all customer audits at Subcon
5) Drive the subcon to achieve the Automotive Quality level
6) Coordinate all Safety, Health and Environment activities including OSHAS 18000 and EMS ISO14000 Audits
7) Coordinate and align the deployment of policy and strategy in Plating
任职要求
Qualification:
-4 years degree in an engineering (Chemical , Mechanical, and other related areas)
-Minimum 5 years experience in semiconductor plating experience
Specific :
1) Actual semiconductor plating process knowledge.
2) Knowledge in Problem Solving Skill eg 8D and Poka Yoke
3) People Management through effective Interpersonal Skills, Self Managing Team (SMT), Small Group Activity (SGA) and Total Productive Maintenance (TPM)
4) Knowledge on Backend Semiconductor Process
General:
1) Ability to lead, motivate and develop excellent Performance among employee.
2) Well develop personal management and human organization skills.
3) Analytical and having strong decision making capabilities
4) Able to work independently and posses good communication skills
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