| IPC-TR-470 | Thermal Characteristics of Multilayer Interconnection Boards (多层互连板的热特性) | 1/74 (orig. pub.) |
| IPC-TR-474 | An Overview of Discrete Wiring Techniques (分立线路综观) | 3/79 (orig. pub.) Reprint 1984 |
| IPC-TR-476 | How to Avoid Metallic Growth Problems on Electronic Hardware (如何避免电子硬件的合金化生长) | 9/77 (orig. pub.) A 6/84 |
| IPC-TR-480 (作废) | Results of Multilayer Test Program Round Robin IV Phase I | 9/75 (orig. pub.) |
| IPC-TR-481 | Results of Multilayer Test Program Round Robin V (多层V循环测试程序的结果) | 4/81 (orig. pub.) |
| IPC-TR-483 | Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄层压板尺寸稳定性测试 ) | 4/84 (orig. pub.) 10/87 Addendums Revised 3/91 |
| IPC-TR-484 | Results of IPC Cooper Foil Ductility Round Robin Study (IPC Cooper 箔延展性研究联合报告) | 4/86 (orig. pub.) |
| IPC-TR-485 | Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔断裂强度研究联合报告) | 3/85 (orig. pub.) |
| IPC-TR-549 | Measles in Printed Wiring Boards (印制板内的粉点) | 11/73 (orig. pub.) |
| IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components (电子元件安装互连印制板的质量评定) | 7/93 (orig. pub.) |
| IPC-DR-570 | General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards (1/8英寸印制板硬质合金钻头总技术规范) | 1/79 (orig. pub.) A 4/84 |
| IPC-DR-572 | Drilling Guidelines for Printed Boards (印制板钻孔指南) | 4/88 (orig. pub.) |
| IPC-TR-576(已作废) | Additive Process Evaluation | 9/77 (orig. pub.) |
| IPC-TR-578 | Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards (前沿制造技术报告---- ) | 9/84 (orig. pub.) |
| IPC-TR-579 | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards (印制板小孔金属化可靠性评估联合报告) | 9/88 (orig. pub.) |
| IPC-TR-580 | Cleaning and Cleanliness Test Program Phase 1 Test Results (清洗和洁净度测试程序第1阶段测试结果) | 10/89 (orig. pub.) |
| IPC-TR-581 | IPC Phase 3 Controlled Atmosphere Soldering Study IPC Phase 3 可控气氛焊接研究) | 8/94 (orig. pub.) |
| IPC-TR-582 | IPC Phase 3 No-Clean Flux Study (IPC Phase 3免洗助焊剂研究) | 11/94 (orig pub.) |
| IPC-A-600 | Acceptability of Printed Boards (印制 板可接收条件) | orig pub. '64 A '70 B '74 C '78 D '89 E 8/95 F 11/99 |
| IPC-QE-605A | Printed Board Quality Evaluation Handbook (印制板质量评定手册) | Revision A: 2/99 |
| IPC-SS-605 | Printed Board Quality Evaluation Slide Set (印制板质量评定,幻灯片) | |
| IPC-A-610 | Acceptability of Electronic Assemblies (电子组装的可接收条件) | 8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88 A 3/90 B 12/94 Amendment 1/96 Revision C: 1/00 |
| IPC-QE-615 | Assembly Quality Evaluation Handbook (组装质量评定手册) | 3/93 (orig. pub.) |
| IPC-SS-615 | Assembly Quality Evaluation Slide Set (组装质量评定,幻灯片) | 3/93 (orig. pub.) Revision A: 2/99 |
| IPC-AI-640 (已作废) | User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates | 1/87 (orig. pub.) |
| IPC-AI-641 | User's Guidelines for Automated Solder Joint Inspection (自动焊点检查用户指南) | 1/87 (orig. pub.) |
| IPC-AI-642 | User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's (照相底图,内层和PCB裸板自动检查用户指南) | 10/88 (orig. pub.) |
| IPC-OI-645 | Standard for Visual Optical Inspection Aids (光学检查目测标准) | 10/93 (orig. pub.) |
| IPC-TM-650 | Test Methods Manual (测试方法手册) | Updated per test method |
| IPC-ET-652 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (PCB裸板电气测试要求和导则) | 10/90 (orig. pub.) |
| IPC-QL-653 | Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material (检查/测试印制板,元件和材料的设备鉴定) | 8/88 (orig. pub.) A 11/97 |
| IPC-MI-660 | Incoming Inspection of Raw Materials Manual (原材料来料检查手册) | 2/84 (orig. pub.) |
| IPC-R-700C 被 IPC-7711/ 7721替代 | Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies | 9/67 (orig. pub.) A 12/71 B 9/77 C 1/88 |
| IPC-TA-720 | Technology Assessment Handbook on Laminates (层压板技术评估手册) | |
| IPC-TA-721 | Technology Assessment Handbook on Multilayer Boards (多层板技术评估手册) | |
| IPC-TA-722 | Technology Assessment of Soldering (焊接技术评估) | |
| IPC-TA-723 | Technology Assessment Handbook on Surface Mounting (表面组装技术评估手册) | |
| IPC-TA-724 | Technology Assessment Series on Cleanrooms (净化间技术评估) | 4/98 |
| IPC-PE-740 | Troubleshooting Guide for Printed Board Manufacture and Assembly (印制板制造及组装故障修理指南) | 1/85 (orig pub.) A 12/97 |
| IPC-CM-770 | Printed Board Component Mounting (印制板元件安装) | 9/68 (orig. pub.) A 3/76 B 10/80 C 1/87 D 1/96 |
| IPC-SM-780 | Component Packaging and Interconnecting with Emphasis on Surface Mounting (片式元件SMC的封装和互连) | 3/88 (orig. pub.) |
| IPC-SM-782 | Surface Mount Design and Land Pattern Standard (表面组装设计和焊盘图形标准) | 3/87 (orig. pub.) 9/89 A 8/93 Amendment 1 10/96 |
| IPC-EM-782 | Surface Mount Design and Land Pattern Spreadsheet (表面组装设计和焊盘图形电子表格) | 9/94 (orig. pub.) Addendum 12/95 |
| IPC-SM-784 | Guidelines for Chip-on-Board Technology Implementation (COB技术应用指南) | 11/90 (orig. pub.) |
| IPC-SM-785 | Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments (表面组装焊接可靠性加速试验指南) | 11/92 (orig. pub.) |
| IPC-SM-786已被 J-STD-020替代 | Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs | 12/90 (orig. pub.) A 1/95 |
| IPC-MC-790 | Guidelines for Multichip Module Technology Utilization (多芯片模块技术应用指南) | 8/92 (orig. pub.) |
| IPC-S-804被 J-STD-003替代 | Solderability Test Methods for Printed Wiring Boards | 1/82 (orig. pub.) A 1/87 |
| IPC-S-805被 J-STD-002替代 | Solderability Tests for Component Leads and Terminations | 1/85 (orig. pub.) |
| IPC-MS-810 | Guidelines for High Volume Microsection (显微切面指南) | 10/93 (orig. pub.) |
| IPC-S-815被 J-STD-001替代 | General Requirements for Soldering Electronic Interconnections (已废除,由J-STD-001替代) | 11/77 (orig. pub.) A 6/81 B 12/87 |
| IPC-S-816 | SMT Process Guideline and Checklist ( SMT工艺指南和检查表) | 7/93 (orig. pub.) |
| IPC-SM-817 | General Requirements for Dielectric Surface Mounting Adhesives (绝缘性表面组装胶粘剂通用规范) | 11/89 (orig. pub.) |
| IPC-SF-818 被 J-STD-004替代 | General Requirement for Electronic Soldering Fluxes (用于电子组件焊接的助焊剂通用技术要求) | 2/88 (orig. pub.) 12/91 |
| IPC-SP-819 被J-STD-005替代 | General Requirements and Test Methods for Electronic Grade Solder Paste | 10/88 (orig. pub.) |
| IPC-AJ-820 | Assembly and Joining Manual (组装和连接手册) | 8/96 (orig. pub.) |
| IPC-CA-821 | General Requirements for Thermally Conductive Adhesives (热导胶粘剂通用技术要求) | 1/95 (orig. pub.) |
| IPC-CC-830 | Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies (印制板组装电绝缘材料的鉴定和性能) | 1/84 (orig. pub.) 4/90 Reaffirmed A 10/98 |
| IPC-SM-839 | Pre and Post Solder Mask Application Cleaning Guidelines (焊接前,后阻焊膜的清洗指南) | 4/90 (orig. pub.) |
| IPC-SM-840 | Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards (印制板阻焊膜的鉴定和性能) | 11/77 (orig. pub.) A 7/83 B 5/88 C 1/96 |
| IPC-H-855 (己作废) | Hybrid Microcircuit Design Guide | 10/82 (orig. pub.) |
| IPC-D-859 | Design Standard for Thick Film Multilayer Hybrid Circuits (厚膜多层混合电路设计标准) | 12/89 (orig. pub.) |
| IPC-HM-860 | Specification for Multilayer Hybrid Circuits (多层厚膜电路技术规范) | 1/87 (orig. pub.) |
| IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Boards (聚合物厚膜印制板的鉴定和性能) | 11/89 (orig. pub.) |
| IPC-D-949被IPC-D-275替代 | Design Standard for Rigid Multilayer Printed Boards | 1/87 (orig. pub.) |
| IPC-ML-950被 IPC-RB-276替代 | Performance Specification for Rigid Multilayer Printed Boards | 1/66 (orig. pub.) A 9/70 B 12/77 C 11/86 |
| IPC-ML-960 | Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards (多层印制板预制内层敷箔板的鉴定和性能规范) | 7/94 (orig. pub.) |
| IPC-ML-975 被IPC-D-325替代 | End Product Documentation Specification for Multilayer Printed Wiring Boards | 9/69 (orig. pub.) |
| IPC-ML-990 (作废) | Performance Specification for Flexible Multilayer Wiring | 9/72 (orig. pub.) |
| IPC-1402/IPC-H-855 | Hybrid Microcircuit Design Guide (混合微波电路设计指南) | 10/82 (orig. pub.) |
| IPC-1710 | OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP印制板OEM制造商资格鉴定一览表) | 2/94 (orig. pub.) 12/97 updated |
| IPC-1720 | Assembly Qualification Profile (AQP印制板组装制造商资格鉴定一览表) | 7/96 (orig. pub.) |
| IPC-1730 | Laminator Qualification Profile (LQP) (层压板制造商资格鉴定一览表) | 1/98 |
| IPC-2141 | Controlled Impedance Circuit Boards and High Speed Logic Design (阻抗调制电路板和高速逻辑电路设计) | 4/96 (orig. pub.) |
| IPC-2221 代替 IPC-D-275 | Generic Standard on Printed Board Design (印制板设计通用标准) | 2/98(orig. pub.) |
| IPC-2222 代替 IPC-D-275 | Sectional Design Standard for Rigid Organic Printed Boards (刚性有机印制板设计标准) | 2/98(orig. pub.) |
| IPC-2223 | Sectional Design Standard for Flexible Printed Boards (柔性印制板设计标准) | 11/98 |
| IPC-3406 | Guidelines for Electrically Conductive Surface Mount Adhesives (表面组装导电胶导则) | 7/96 (orig. pub.) |
| IPC-3408 | General Requirements for Anistropically Conductive Adhesive Films (各向异性导电胶粘剂通用技术要求) | 11/96 (orig.pub.) |
| IPC-4101 代替 IPC-L-108/109 IPC-L-112/115 | Specification for Base Materials for Rigid and Multilayer Boards (刚性及多层印制板基材特性规范) | 12/97 (orig. pub.)* |
| IPC-4110 | Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards (非织物纤维纸印制板的特性和规格) | 8/98* |
| IPC-4130 | Specification and Characterization Methods for Nonwoven "E" Glass Mat (非织物‘E’玻璃垫规范) | 9/98* |
| IPC-6011 | Generic Performance Specification for Printed Boards (印制板通用性能规范) | 7/96 (orig. pub.)* |
| IPC-6012 | Qualification and Performance Specification for Rigid Printed Boards (刚性印制板的鉴定与性能规范) | 7/96 (orig. pub.) A 10/99 |
| IPC-6013 | Qualification and Performance Specification for Flexible Printed Boards (柔性印制板的鉴定与性能规范) | 11/98 |
| IPC-6015 | Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures (有机多芯片模块(MCM-L)组装及互连结构的鉴定和性能规范) | 2/98 (orig. pub.) |
| IPC-6018 | Microwave End Product Board Inspection and Test (微波产品电路板的检查和测试) | 1/98(orig. pub.) |
| IPC/JPCA-6202 | Performace Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards (单、双面柔性印制电路板性能指导手册) | 2/99 |
| IPC-7711 代替 IPC-R-700C | Rework of Electronic Assemblies (电子组件的返修) | 4/98 (orig. pub.) |
| IPC-7721 代替 IPC-R-700C | Repair and Modification of Printed Boards and Electronic Assemblies (印制板和电子组件的修理和调整) | 4/98 (orig. pub.) |
| IPC-9191代替IPC-PC-90 | General Guideline for implementation of Statistical Process Control (SPC) (SPC实施通则) | 11/99 (orig.pub) |
| IPC-9201 | Surface Insulation Resistance Handbook (表面绝缘电阻手册) | 7/96 (orig. pub.) |
| IPC-9501 | PWB Assembly Process Simulation for Evaluation of Electronic Components (电子元件组装工艺仿真的评价) | 7/95 (orig. pub.) Revision A: In process |
| IPC-9504 | Assembly Process Simulation for Evaluation of Non-IC Components (非IC器件组装工艺仿真的评价) | 6/98 |
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