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关于蓝牙的问题以及建议 [复制链接]

 There have been problems about the Drive of form MAX32630FTHR, as follows,
1. As to mbed, the BLE API can be supported. While the mbed still could not release the Borad level drive, there is no documents about how to link the MAX32630FTHR hardware for mbed BLE API.
There have been good job for another board on mbed-supported with SPI to BLE module, ie, SENDENV version, which I test OK.
But there shall be more work to do , if UART-HCI shall be used for TI-CC254x based PAN-module.
Hopefully, mbed supported be released sooner or documents on how to porting HCI BLE module.
2. Another way is to drive TI-CC254x via Keil directly. That means , the protocle for HCI -BLE module shall be open to developers. That is hardware drive, in our design, not all the BLE service shall be needed, it would not neccesary for complete BLE stack like that of TI-BLE- stack.
Without the above two solution. all the project can not move forward, but to waiting.

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感谢您的建议,我会第一时间反馈给厂商~  详情 回复 发表于 2017-8-29 14:45
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感谢您的建议,我会第一时间反馈给厂商~
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