经过一段时间的等待,bbb 的扩展版焊接好了,看看几张实物图片:
因为在淘宝买的加长双排排针还没有到,目前使用单排的排阵将需要的管脚焊接出来,可能显的不是那么紧凑,嘿嘿。
在上一张测试调试一个 STM32F103CBT6 的图片看看:
下面就是使用 gdb 通过 BBB + 扩展版(bbb RMP) 调试 STM32 的过程。整个项目是我魔改的 black magic probe 项目,看下 gdb 正常识别到 STM32 的打印信息:
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Reading symbols from out/RLM.elf...
Target already powered (3.2V)
Target voltage: 3.2V
Available Targets:
Available Targets:
No. Att Driver
1 STM32F1 medium density M3
_stm32_lora_write (buffer=0x20000ba4 <lora_app_stack+892> "\202\377\377\300\260\v",
len=4) at ../bsp/stm32f103-led/drivers/lora.c:150
150 LL_SPI_TransmitData8(SPI1, buffer<i>);
(gdb) q
目前单步也可以,就是有点问题,不知道为什么还是需要用示波器探头或者电压表探头点着 TMS 这里的匹配电阻任意一端才可以,排除了焊接接触不良(已经补焊过还是一样的问题),希望有大佬可以给点意见。
感觉还有很长的路要走。期待下篇更新。