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第一章基础培训教材第一节常用术语解释(一)········· ····················· 1
1.组装图
1
2.轴向引线元件
1
3.单端引线元件
1
4.印刷电路板
1
5.成品电路板
1
6.单面板
1
7.双面板
1
8.层板
2
9.焊盘
2
10.元件面
2
11.焊接面
2
12.元件符号
2
13.母板
2
14.金属化孔(PTH)
2
15.连接孔
2
16.极性元件
2
17.极性标志
2
18.导体
2
19.绝缘体
2
20.半导体
3
21.双面直插
3
22.套管
3
23.阻脚
3
24.管脚打弯
····················· 3
25.预面型
3
第一节常用术语解释(二)··········· 4·······················
1.空焊··········· 4
2.假焊········· 4······················· ······················· ·······················
3.冷焊··········· 4·······················
4.桥接··········· 4·······················
5.错件··········· 4
6.缺件··········· 4
7.极性反向···· 4
8.零件倒置 ·· 4
9.零件偏位···· 4······················· ·······················
10.锡垫损伤·· 4
11.污染不洁
4
12.爆板
4
13.包焊 ······· 4
.....................................................................................................................以下还有,限于篇幅,省去...
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