【招聘】天津急招Senior Packaging Engineer
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本公司是一家专注在IC行业的猎头公司KTHR(www.kthr.com),主要为IC设计、芯片制造、IC市场与销售、IC应用(硬件与底层软件开发)等高级人才服务,客户主要为欧美著名半导体公司和美资新公司,如TI、ADI、Freescale等共20多家。
大家可以叫我Joy,现正受一家美资的半导体公司招聘 Senior Packaging Engineer/ Packging Manager
Product Packaging Engineer/Section Head (Global Package Engineering) - Lead cross-functional IC package New Product Introduction programs from product conception through production ramp leveraging global Freescale manufacturing resources, total ownership of schedule and execution in support of overall NPI program goals
- Drive IC package and assembly input during product concept and die design phases to ensure reliable, design for manufacturability products launch and cost-effective IC packaging solutions and designs
- Liase and work closely with NPI project team members, involving various department MBUs, Supply Management and customers to ensure smooth implementation of projects
- Define NPI bill of materials and assembly process flows
- Link with factory-based product engineering teams to support package and/or assembly materials and process continuous improvement during early production ramps.
- Provide technical issue resolutions for major customers or manufacturing issues related to package system designs
- Provide primary point of contact between factory and external or internal customers
Requirements ? Masters/Bachelor’s Degree/Professional qualification in Mechanical/Materials/Metallurgy/Chemical Engineering or its equivalent ? Minimum 2yrs working experience in handling NPI projects. ? Experience in assembly of BGA, PQFN, QFN, QFPs, Flip Chip packges will be an added advantage ? Must be independent, mature and able to work well in teams. ? Fluent in engineering speaking, writing and good in English listening.
有兴趣的可以和我联系 Mail: joy-luo@kthr.com tel: 021-61023600-15
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