BGA Socket

lingmei

BGA Socket [复制链接]

BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,亦可以提供BGA插座的升高设计以便满足客户的实际要求,并可根据实际的BGA器件出脚，定制合适的BGA插座(Available for any chip size and grid pattern)。

产品特点:

• Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die

• Inductance: less than 2nH

• -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style

• available for any chip size and grid pattern

• Same PCB layout as the IC (no holes required for SMD socket)

• Minimal keepout area of 6mm beyond the IC’s periphery

• Raised SMD style for lifting socket over adjacent components

• Low profile socket (standard Twist Lock is less than 10mm high with IC)

• Contact force: max 40 grams per contact; lower forces available

• Semi-custom design = lower cost and tailored to your needs

Twist Lock	Fast Lock	Clamshell
Elastomer sockets	Knob Lock	Solderless Compression Type
Quick Lock	QFN / MLF / MLP Socket	Sockets with SMT solderball adapters
ZIF Lever Lock	QFP/PQFP/SOIC/SO etc	BGA Adapters
BGA Socket Accessories & Special Features

jjkwz

这也有点太专业机械方面的了吧